RFID - Parmod® silver ink's high conductivity produces RFID tags with longer read distance and 70% less silver compared to tags printed with polymer thick film. Antenna features as fine as 100 microns (0.16 mils) can be printed and cured as low as 135°C - 150°C to produce low cost circuits, a key need in this fast-growing marketplace.

 

Membrane Touch Switches - Parmod® inks can be printed and cured on a reusable substrate and transfer laminated to substrates such as polyester to produce membrane switches and computer keyboards. Parmod® silver ink's high conductivity can reduce silver consumption 70% compared to polymer thick film. Parmod® copper ink can be used with polyimide substrates to produce solderable membrane switches at lower cost than the traditional etching process.

Flexible Circuits and Inner Layers - Substantial cost reductions can be achieved in the production of circuitry on thin substrates through the simplified two-step Parmod® process. Reel to reel processing is possible for still greater cost reduction.

High Density Interconnect - Parmod® inks can be used to metallize microvias and fine conductor lines in high density interconnect applications such as build-up circuit boards and semiconductor packaging.