Parmod® is a mixture of one or more powders with a reactive organic medium (ROM). It is formulated as an ink, paste or toner for printing electrically functional components–such as conductors, resistors, capacitors and inductors.

When Parmod® images are heated to 135°C - 300°C, the powders consolidate into a "chemically welded" continuous single phase. This means that components typically made by conventional "thick film" technology on ceramic substrates (which is based on metallurgical sintering at bright red heat) can now be made by Parmod® technology on polymeric substrates.

Most applications to date are focused on electronic interconnects. Using Parmod® technology, patterns of copper or silver conductors are printed onto polymer-based laminates or polymer films to mount and interconnect electronic components.

Parmod® is a printable ink that yields a solderable pure metal conductor at a temperature low enough to cure on a conventional polymer-based substrate. Its simple two-step production process replaces the six-to-eight step subtractive or semi-additive process currently used to produce printed wiring boards. Parmod® can also be used in direct digital printing–applied with a dispenser or electrostatic printer–to produce circuits directly from computer-aided design files.

Parmod® technology can be applied to a variety of metals, including copper, silver, gold, palladium, platinum, iron, and manganese. Copper and silver inks are commercially available.   

Rigid and flexible polyimide are excellent substrates for use with Parmod® technology. Substrates such as FR-4 epoxy glass, polyester and polyethylene and paper are patterned with Parmod® technology through transfer lamination.

Performance

Parmod® provides higher conductivity than polymer thick film. This enables finer feature size and product miniaturization.