Parmod® Definition

Parmod® is a patented technology that enables the formation of continuous-phase pure metallic conductors at relatively low temperature–making them suitable for application to polymer substrates. Parmod® inks, pastes and toners can be applied by conventional printing processes such as screen or gravure printing to produce fully-additive printed circuits and interconnects.
Parmod® materials are comprised of metal particles and a reactive organic medium (ROM) that volatilizes during the heating process. The Parmod® family of products includes silver and copper, as well as a variety of other metal and oxide compositions.

Cure Temperatures & Substrates

Parmod® products are cured in minutes at temperatures as low as 135°C in a box oven or a roll-to-roll continuous print and cure production line. Temperature-resistant polymers–such as polyimide or FR-4 epoxy glass–allow direct printing of circuits. For cost-sensitive end uses, Parmod® circuits can be printed and cured to low-cost substrates such as polyester, polyethylene, and paper.

Printing

Parmod® inks, pastes, and toners are applied by screen printing, dispensing, or gravure processes to produce fully additive printed circuits and interconnects.
Parelec has also demonstrated the ability to electrostatically print Parmod® compositions. Electrostatic printing can provide increased resolution for finer circuit features, which parallels major industry trends. Parmod® also allows for direct computer-controlled printing for improved production flexibility and inventory reduction.
The high resolution of electrostatic printing, combined with the ability of Parmod® to adhere to glass, enables the printing of thin-film transistor gate lines for thin film transistors (TFTs) used in active matrix liquid crystal displays (AMLCDs).

Patent Status

Parelec, Inc., was awarded U.S. patent #5,882,722 for its Parmod® technology on March 16, 1999. The patent covers materials and methods that Parmod® technology employs. The primary claim covers mixtures printed on polymer-based substrates to make circuits that are cured at temperatures below 450°C. Subsidiary claims cover the type of metals Parmod® uses (copper, silver, gold, palladium, platinum, iron and manganese), as well as its printing processes (screening, stenciling, gravure printing, inkjet printing and electrographic printing). Six Patent Cooperation Treaty applications have been filed to extend coverage worldwide.